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USB Micro-B, horizontal, https://cdn.amphenol-icc.com/media/wysiwyg/files/drawing/10104110.pdf USB Micro B horizontal dustproof waterproof IP67 XKB Connectivity, USB Micro-B, horizontal, https://cdn.amphenol-icc.com/media/wysiwyg/files/drawing/10104110.pdf USB Micro B horizontal SMD USB Power-only Charging-only 6P 6C USB4135-GF-A 16-pin USB-C receptacle, USB2.0 and PD, 5A VBUS rating, https://datasheet.lcsc.com/lcsc/2211161000_HCTL-HC-TYPE-C-16P-01A_C2894897.pdf USB 3.0 type A right angle right angle DPDT push button https://www.e-switch.com/system/asset/product_line/data_sheet/210/800U.pdf CuK miniature slide switch, EG series, SPDT, https://www.e-switch.com/wp-content/uploads/2022/06/EG.pdf tactile switch, 7.3mm x 6.25mm x 7.4mm, right angle, http://www.ckswitches.com/media/1422/js.pdf CuK miniature slide switch, right-angle, http://www.ckswitches.com/media/1422/js.pdf switch spdt 0 3 3 Button_Switch_SMD SW_SPDT_PCM12 Ultraminiature Surface Mount Double Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-7810745, 7 Pins (http://www.molex.com/pdm_docs/sd/559350210_sd.pdf), generated with kicad-footprint-generator Soldered wire connection, for 4 times 2.5 mm² wires, basic insulation, conductor diameter 2mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 0.15 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, YBG pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf BGA 6 0.4 YFF0006 Texas Instruments, DSBGA, area grid, NSMD, YZP0005 pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf BGA 6 0.4 YFF0006 Texas Instruments, DSBGA, area grid, YBG pad definition, 1.468x0.705mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf BGA 12 0.5 R-XBGA-N12 Texas Instruments, QFM MOF0009A, 6x8x2mm (http://www.ti.com/lit/ml/mpsi063a/mpsi063a.pdf QFN, 41 Pin (http://www.ti.com/lit/ml/mpqf506/mpqf506.pdf QFN, 28 Pin (http://www.analog.com/media/en/technical-documentation/data-sheets/3555fe.pdf#page=32), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Angled solder pin 1 x 1 mm, 734-132 , 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-147-02-xxx-DV-BE-A, 47 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator LED SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://www.vishay.com/docs/20052/crcw0201e3.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0230, 2 Pins.

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