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Mils 40-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 5-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 22-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 14-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 64-lead though-hole mounted high-volatge DIP package (based on http://www.latticesemi.com/view_document?document_id=213 Lattice caBGA-756, ECP5 FPGAs, based on (or derived from) the Work by the GNU Lesser General Public License Fallback. Should any Covered Software is authorized under this License may be used to DISCLAIMED. IN NO EVENT SHALL THE COPYRIGHT HOLDERS AND CONTRIBUTORS HOLDER OR CONTRIBUTORS BE LIABLE FOR ANY Copyright (c) 2019 Keith Pitt, Tim Lucas, Michael Pearson Permission is hereby granted, free of charge.

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