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Diameter=6.3mm, Electrolytic Capacitor C, Rect series, Radial, pin pitch=10.00mm, , diameter*width=14.5*5.0mm^2, Capacitor, http://www.vishay.com/docs/28535/vy2series.pdf C Disc series Radial pin pitch 27.50mm length 29mm width 11.9mm Capacitor C, Rect series, Radial, pin pitch=37.50mm, , length*width=41.5*40mm^2, Capacitor, http://www.wima.com/EN/WIMA_MKS_4.pdf C Rect series Radial pin pitch 5.00mm diameter 10.0mm 2 pins LED, , diameter 1.8mm size 1.8x2.4mm^2 z-position of LED center 2.0mm, 2 pins LED, diameter 5.0mm z-position of LED center 3.0mm, 2 pins diameter 3.0mm z-position of LED center 1.6mm 2 pins diameter 5.0mm z-position of LED center 3.0mm 3 pins IR-LED, diameter 3.0mm, 2 pins, diameter 5.0mm z-position of LED center 9.0mm 2 pins Red 5381 Series LED A20 Olinuxino LIME2, 1.2GHz, 512-1024MB RAM, Micro-SD, NAND or eMMC, 1000Mbit Ethernet A20 Olimex Olinuxino LIME2 development board Common footprint for ECP5 FPGAs, 27.0x27.0mm, 756 Ball, 32x32 Layout, 0.8mm Pitch, http://www.latticesemi.com/view_document?document_id=213 Analog Devices (Linear Tech), 133-pin BGA uModule, 15.0x15.0x4.92mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf MAPBGA 9x9x1.11 PKG, 9.0x9.0mm, 272 Ball, 17x17 Layout, 0.8mm Pitch, https://www.ti.com/lit/ml/mpbg777/mpbg777.pdf BGA 289 0.8 ZAV S-PBGA-N289 Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (perimeter) array, NSMD pad definition Appendix A BGA 196 0.5 CPGA196 Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 3.0x1.9x0.625mm, 28 ball 7x4 area grid, NSMD, YZP0005 pad definition, 0.704x1.054mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition Appendix A Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=303, NSMD pad definition Appendix A BGA 1924 1 FF1926 FFG1926 FF1927 FFG1927 FFV1927 FF1928 FFG1928 FF1930 FFG1930 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=264, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 12 bump 4x3 grid, NSMD pad definition Appendix A BGA 484 1 FB484 FBG484 FBV484 Artix-7, Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=276, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double rows Through hole angled pin header, 2x02, 1.00mm pitch, single row Through hole IDC box header THT 1x37 1.27mm single row Through hole angled socket strip, 2x32, 2.00mm pitch, single row style1 pin1 left Surface mounted socket strip THT 2x12 2.00mm double row Through hole straight socket strip, 2x18, 1.00mm pitch, single row style1 pin1 left Surface mounted socket strip THT 2x08 2.54mm double row surface-mounted straight socket strip, 1x05, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header SMD 1x13 2.54mm single row (from Kicad 4.0.7), script generated.

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