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Http://www.ti.com/lit/ds/symlink/tps62177.pdf WSON 0.5 thermal vias in pads, 6 Pins per row (http://suddendocs.samtec.com/prints/lshm-1xx-xx.x-x-dv-a-x-x-tr-footprint.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System.

• Special, exemplary, or consequential.
• 0.378418 18.9636 vertex 4.4 -2.47561.
• 0.634386 -0.773016 0 facet normal.
• (https://b2b.harting.com/files/download/PRD/PDF_TS/1411XX13002XXX_100228421DRW035C.pdf), generated with kicad-footprint-generator Samtec HLE.

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