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7.5x5.0mm^2 package crystal Epson Toyocom FA-238 series http://www.mouser.com/ds/2/137/1721499-465440.pdf, hand-soldering, 3.2x2.5mm^2 package crystal Ceramic Resin Sealed SMD http://www.foxonline.com/pdfs/fe.pdf, 7.5x5.0mm^2 package SI570, SI571, Programmable oscillator, Standard SI570 SI571 Programmable oscillator Standard SMD Crystal SERIES SMD0603/4 http://www.petermann-technik.de/fileadmin/petermann/pdf/SMD0603-4.pdf, hand-soldering, 6.0x3.5mm^2 package SMD Crystal Seiko Epson SG-8002LB https://support.epson.biz/td/api/doc_check.php?mode=dl⟨=en&Parts=SG-8002DC, hand-soldering, 5.0x3.2mm^2 package 14-lead dip package, row spacing 7.62 mm (300 mils), body size 6.7x11.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 10x-dip-switch SPST , Slide, row spacing 25.4 mm (1000 mils THT DIP DIL ZIF 7.62mm 300mil SMDSocket SmallPads 40-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 5-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300.

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