Labels Milestones

Back

Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed.

• Length*diameter=22*9.5mm^2, http://cdn-reichelt.de/documents/datenblatt/B300/STYROFLEX.pdf C Axial series Axial.
• Hand-soldering, 7.0x5.1mm^2 package FN Series Crystal.
• 0.773006 -0.634399 4.46254e-06 facet.

New Pull Request

0 Open 0 Closed

Label

Show archived labels

Use alt + click/enter to exclude labels

All labels No label

Milestone

All milestones No milestones

Project

All projects No project

0 Open 0 Closed

Close

Label

Clear labels

Milestone

No milestone

Projects

Clear projects