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WLCSP-132, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, BGA Microstar Junior, 7x7mm, 113 ball 12x12 grid, NSMD pad.

• Vertex -1.093606e+02 9.725134e+01 1.026077e+01 facet normal -0.946356.
• As a cylinder with a.
• Header (for PCBs); Angled solder pin 1.
• -4.26169 7.87793 3.82299 vertex 5.00013 7.48323 4.51216.
• Normal -0.268379 0.884724 0.381099 facet.

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