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Pitch, https://www.onsemi.com/pdf/datasheet/ncp163-d.pdf#page=23 6pin Pitch 0.4mm 8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf.

• Inductor WE-PD2 TypMS Wuerth Power Inductor, SMS-ME3015.
• Normal -0.816077 -0.545281 -0.191536.
• SMDSocket, LongPads 5-lead though-hole mounted DIP package, row.
• Normal -9.989484e-01 -0.000000e+00 -4.584886e-02.

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