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1x36, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 12.0mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole straight pin header, 2x12, 1.27mm pitch, double rows Through hole angled pin header, 1x29, 1.00mm pitch, double rows Through hole socket strip THT 2x19 1.27mm double row surface-mounted straight socket strip, 2x01, 2.00mm pitch, double rows Surface mounted socket strip THT 1x02 5.08mm single row Through hole straight pin header, 2x18, 2.54mm pitch, double rows Through hole angled pin header THT 1x05 2.54mm single row style1 pin1 left Surface mounted pin header THT 2x21 2.00mm double row surface-mounted straight socket strip, 2x38, 1.00mm pitch, single row style1 pin1 left Surface mounted pin header SMD 1x14 1.27mm single row Through hole pin header THT 2x13 1.27mm double row Through hole straight socket strip, 2x28, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header SMD 1x19 2.00mm single row Surface mounted pin header SMD 1x24 2.00mm single row (from Kicad 4.0.7), script generated Surface mounted pin header THT 1x07 1.00mm single row style1 pin1 left Surface mounted pin header THT 2x11 1.00mm double row surface-mounted straight pin header, 2x03, 2.00mm pitch, 6.35mm socket length, double rows Through hole socket strip THT 1x33 2.00mm single row style2 pin1 right Through hole vertical IDC box header, 2x25, 1.27mm pitch, 3.9x4.9mm body, exposed pad, Analog Devices KS-4, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/sc70ks/ks_4.pdf Analog Devices (Linear Tech), 133-pin BGA uModule, 15.0x15.0x4.92mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf MAPBGA 9x9x1.11 PKG, 9.0x9.0mm, 272 Ball, 17x17 Layout, 0.5mm Pitch, https://www.diodes.com/assets/Datasheets/AP22913.pdf WLCSP-4, 0.64x0.64mm, 4 Ball, 2x2 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7a3ai.pdf ST WLCSP-156, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf ST WLCSP-115, ST die ID 483, 3.73x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, area grid, NSMD, YZP0005 pad definition, 0.8875x1.3875mm, 5 Ball, 2x3 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, YZR pad definition Appendix A BGA 900 1 FF900 FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275, NSMD pad definition.

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