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300mil LongPads 4-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 16-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 10-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 48-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD DIP DIL ZIF 7.62mm 300mil 3-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 64-lead though-hole mounted DIP package, row spacing.

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