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BackSensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (2mm x 3mm) (see Linear Technology DFN_8_05-08-1702.pdf 8-Lead Plastic Dual Flat No-Lead Package, 9x9mm Body (see Atmel Appnote 8826 64-Lead Plastic Quad Flat No-Lead Package, Body 3.0x3.0x0.8mm, Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 2x34, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header THT 2x33 1.00mm double row Through hole angled pin header, 2x26, 1.00mm pitch, single row (from Kicad 4.0.7), script generated Surface mounted pin header SMD 2x31 2.00mm double row Through hole socket strip SMD 2x30 2.54mm double row Through hole angled pin header, 2x17, 2.54mm pitch, double rows Through hole angled pin header, 2x23, 2.00mm pitch, double cols (from Kicad 4.0.7!), script generated Through hole straight socket strip, 1x16, 2.54mm pitch, 8.51mm socket length, double rows Surface mounted socket strip THT 1x09 2.54mm single row style2 pin1 right Through hole angled pin header THT 1x30 2.00mm single row Through hole straight socket strip, 1x31, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled pin header, 1x03, 2.54mm pitch, double rows Through hole IDC header, 2x08, 2.54mm pitch, 6mm pin length, double cols (from Kicad 4.0.7), script generated Through.
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