Labels Milestones
Back(http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator connector Hirose DF11 through hole, DF63R-5P-3.96DSA, 5 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 36 Pin (JEDEC MO-194 Var AF https://www.jedec.org/document_search?search_api_views_fulltext=MO-194), generated with kicad-footprint-generator Hirose DF13 through hole, DF63M-2P-3.96DSA, 2 Pins per row, Mounting: PCB Mounting Flange (http://www.molex.com/pdm_docs/sd/039291047_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py VQFN, 48 Pin (http://www.ti.com/lit/ds/symlink/cc430f5137.pdf#page=128), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 3, Wuerth electronics 9775026360 (https://katalog.we-online.com/em/datasheet/9775026360.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py WDFN, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_TDFN_2x3_MNY_C04-0129E-MNY.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP28: plastic thin shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline package; 14 leads; body width 5.3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf 14-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_16_05-08-1709.pdf DHC Package; 16-Lead Plastic Small Outline Narrow Body Body [QSOP] (see Microchip Packaging Specification.
- Tag-Connect programming header; http://www.tag-connect.com/Materials/TC2030-IDC.pdf tag connect programming header.
- Schematics/MK_Schematic.png rename MK_VCO_RADIO_SHAEK.diy => Schematics/MK_VCO_RADIO_SHAEK.diy.