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SPST Omron_A6S-610x, Slide, row spacing 25.4 mm (1000 mils), Socket 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see https://www.power.com/sites/default/files/product-docs/lnk520.pdf Power Integrations variant of MSOP-16 (see https://www.analog.com/media/en/technical-documentation/data-sheets/3748fb.pdf MFSOP 4 pin straight chassis connector http://www.te.com/usa-en/product-1-1478204-0.html BNC female PCB mount 4 pin, Right Angle, Surface Mount, ZIF, 15 Circuits (https://www.molex.com/pdm_docs/sd/5022311500_sd.pdf molex FFC/FPC connector Pitch 0.5mm http://www.ti.com/lit/ds/symlink/tpd4e02b04.pdf USON-10 2.5x1.0mm Pitch 0.5mm right angle 3mm spherical light pipe 1 way 3mm PhotoDiode, plastic SMD DIL, 4.5x4mm² PhotoDiode plastic DIL RM5.08 PhotoTransistor, sidelooker package, RM2.54 PhotoTransistor sidelooker package RM2.54 package for Kodenshi SG-105 with PCB locator, 8 Pins (http://www.molex.com/pdm_docs/sd/5024260810_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, http://www.st.com/content/ccc/resource/technical/document/technical_note/92/30/3c/a1/4c/bb/43/6f/DM00103228.pdf/files/DM00103228.pdf/jcr:content/translations/en.DM00103228.pdf pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf UFD Package, 4-Lead Plastic Stretched Small Outline Narrow Body (QR)-.150" Body [QSOP] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack (PF) - 14x14mm body, 9.5mm sq thermal pad with vias; (http://www.ti.com/lit/ds/symlink/drv8800.pdf HTSSOP, 16 Pin (http://www.ti.com/lit/ds/symlink/drv8801.pdf#page=31 MO-220 variation VJJD-2), generated with kicad-footprint-generator Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 5566-02A2, example for new part number: A-41791-0009 example for new part number: 22-27-2041, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-108-02-xx-DV-PE-LC, 8 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Hirose series connector, SM14B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator Harwin Female Vertical Surface Mount Fuse, 3 x 6mm drills Triple banana socket, footprint - 6mm drill Dual banana socket, footprint - 6mm drill Dual banana socket, footprint - 2 x switching (normalling) stereo jack (T/R/S), https://www.neutrik.com/en/product/nj3fd-v 6.35mm (1/4 in) Vertical Jack, 3 x switching (normalling) stereo jack without switching contact, horizontal PCB mount, https://www.neutrik.com/en/product/ncj6fa-h Combo A series, 3 pole male XLR receptacle, grounding: separate ground contact connected to shell ground, but not to front panel b77534e3fc83cf3f21d8c938a2ebb93ca539acd3 updated README.md updated README.md 32ece2d681b26731bad50902587b988d6a79e43e updated README.md f0ccd475bcae4d90f684767b57611a775351886d Update README.md 8fe829edc2a52299443ce1d2193e2aa04d060c17 From b22080a808f5ee5eddd0b607f432f7fa2c4fb139 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Current draw PCB layout: [front](Docs/precadsr_layout_front.pdf), [back](Docs/precadsr_layout_back.pdf) * [BOM](Docs/precadsr_bom.md) * [Build notes](Docs/build.md.

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