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Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip THT 2x32 2.54mm double row Through hole pin header SMD 1x36 2.54mm single row style1 pin1 left Surface mounted pin header SMD 1x30 2.00mm single row Through hole horizontal IDC box header, 2x03, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header SMD 2x38 2.00mm double row Through hole angled socket strip THT 2x17 1.00mm double.

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