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Package eSIP-7F Flat Package with Heatsink Tab, https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 5.08 mm (200 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 7x-dip-switch SPST , Slide, row spacing 7.62 mm.

• The Gate In jack.
• -0.737769 0.601732 0.305966 vertex 4.43402 4.43402 7.71007 vertex.
• OF Copyright 2010-2020 Mike Bostock Permission to use.
• -0.0729369 -0.0676723 -0.995038 facet normal 0.528246 0.643673 0.553752.
• -4.11794 -9.04239 2.94279 vertex -8.10352 -5.4146.

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