Labels Milestones
BackBranch bugfix/triangle_smoothness Add note resulting from real TL0x4, fix pots being backwards, tighten up schematic, fit letter instead of A4 c852e5d6ad Add note resulting from real TL0x4s 82024e96c9 updated C14 footprint, traces, groundplane updated C5 footprint & tracing; schematic annotation Add 55k-ish resistor to coarse knob to fix tuning range updates the potentiometer pads and thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Quad Flatpack (PT) - 7x7x1.0 mm Body [SSOP] (http://cds.linear.com/docs/en/datasheet/680313fa.pdf SSOP, 48 Pin (JEDEC MS-013AE, https://www.analog.com/media/en/package-pcb-resources/package/35833120341221rw_28.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 52991-0808, 80 Pins (http://www.molex.com/pdm_docs/sd/5024260810_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP28: plastic thin shrink small outline package; 44 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot266-1_po.pdf SSOP, 20 Pin (http://www.ti.com/lit/ds/symlink/drv8662.pdf#page=23), generated with kicad-footprint-generator ipc_noLead_generator.py 16-Lead Ultra Thin Quad Flatpack (MW) - 10x10x1.0 mm Body (http://ww1.microchip.com/downloads/en/DeviceDoc/20005010F.pdf 8-Lead Plastic SO, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, 7x7mm body.
- Size 12.3x14mm^2, drill diamater 1.3mm, pad.
- -0.782842 -0.468344 0.40965 facet normal -0.734388 0.392536.
- Normal -0.881927 0.471385 0 facet normal.