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Back# LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes) (with 4 slots T2 5.000mm 0.1969" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes T5 15.200mm 0.5984" (1 hole T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes) T5 15.200mm 0.5984" (1 hole T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) T5 15.200mm 0.5984" (1 hole) Total plated holes count 16 Not plated through holes are merged with plated holes Total unplated holes count 16.
- -5.493214e+000 -1.330315e+000 2.496000e+001 vertex -4.217378e+000 -3.791486e+000 9.983999e+000.
- (600 mils), SMDSocket, LongPads 64-lead though-hole mounted.
- Number: 1836367 8A 320V Generic.
- 0.99513 0.0985702 1.41413e-05 facet.