Labels Milestones
BackThru-hole 16 pin connector, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F215079%7FY1%7Fpdf%7FEnglish%7FENG_CD_215079_Y1.pdf%7F215079-4 connector TE-Connectivity Micro-MaTch Vertical 1-215079-6 8-215079-16 TE-Connectivity Micro-MaTch Vertical 1-215079-6 8-215079-16 TE-Connectivity Micro-MaTch Vertical 2-215079-0 9-215079-20 TE-Connectivity Micro-MaTch female-on-board top-entry thru-hole 6 pin 0.5mm Pitch (http://www.allegromicro.com/~/media/Files/Datasheets/ACS711-Datasheet.ashx Allegro Microsystems 24-Lead Plastic Shrink Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 28-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 18-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 16-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils THT DIP DIL PDIP 2.54mm 7.62mm 300mil 4-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x6.64mm 2x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), LongPads 32-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket.
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