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Inline, Horizontal, Littelfuse 111 (501 and 506), https://m.littelfuse.com/~/media/electronics/datasheets/fuse_clips/littelfuse_fuse_clip_111_datasheet.pdf.pdf Fuseholder Clips, 5x20mm Cylinder Fuse, Pins Inline, Horizontal, Littelfuse 445/030, https://m.littelfuse.com/~/media/electronics/datasheets/fuse_clips/littelfuse_fuse_clip_100_445_030_520_datasheet.pdf.pdf Fuseholder Clips, 5x20mm Cylinder Fuse, Pins Inline, Horizontal, Keystone 3512P, http://www.keyelco.com/product-pdf.cfm?p=1386 Fuseholder Clips, 5x20mm Cylinder Fuse, Pins Inline, Horizontal, Keystone 3512, http://www.keyelco.com/product-pdf.cfm?p=356 Fuseholder Clips, 5x20mm Cylinder Fuse, Pins Inline, Horizontal, Littelfuse 102071, https://www.littelfuse.com/~/media/electronics/datasheets/fuse_clips/littelfuse_fuse_clip_520_521_102071_datasheet.pdf.pdf Heatsink, StoneCold HS, https://www.tme.eu/Document/da20d9b42617e16f6777c881dc9e3434/hs-130.pdf Heatsink, Stonecold, HS, https://www.tme.eu/Document/f7f93f538b934e0b08e09747396fb95f/hs-s.pdf smd shielded power inductor http://www.abracon.com/Magnetics/power/ASPI-3012S.pdf Bourns SRN1060 series SMD inductor Inductor, Bourns, SRP5030T, 5.7mmx5.2mm (Script generated with kicad-footprint-generator Soldered wire connection, for 4 times 2 mm² wire, basic insulation, conductor diameter 1.4mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-xV 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator connector JST XA series connector, B04B-XASK-1-A (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator JST XA series connector, S12B-PH-SM4-TB (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator JST XA series connector, 64800311622 (https://katalog.we-online.com/em/datasheet/6480xx11622.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP10: plastic thin shrink small outline package; 44 leads; body width 4.4 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf 24-Lead Plastic QFN (2mm x 2mm), http://ams.com/eng/content/download/950231/2267959/483138 DD Package; 8-Lead Plastic Dual Flat, No Lead Package (8MA2) - 2x3x0.6 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 8-Lead Plastic Dual Flat, No Lead Package, 1.2x1.8x1.55 mm Body [SOIC] (https://docs.broadcom.com/docs/AV02-0169EN SOIC 1.27 16 12 Wide 16-Lead Plastic Small Outline (SS)-5.30 mm Body [DFN] (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF DD Package; 14-Lead Plastic Thin Shrink Small Outline (SS)-5.30 mm Body [HTSSOP], with thermal pad HTSSOP32: plastic thin shrink.

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