Labels Milestones
BackMounted DIP package, row spacing 10.16 mm (400 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 24-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 22-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket 14-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket, LongPads 40-lead though-hole.
- Series Axial Horizontal pin pitch.
- 2mm soldermask opening Circular.
- 8.343568e-001 2.588207e-001 facet normal 4.064198e-001 7.112355e-001 5.735565e-001 facet.