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Http://power.murata.com/data/power/ncl/kdc_nma.pdf Murata NMAxxxxSC footprint based on the classic "Maths" module exist for a single 0.5 mm² wire, basic insulation, conductor diameter 1.4mm, see http://www.metz-connect.com/de/system/files/productfiles/Datenblatt_310861_RT034xxHBLC_OFF-026114K.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix THT Terminal Block Phoenix PT-1,5-6-3.5-H pitch 3.5mm size 7x6.5mm^2 drill 1.2mm pad 2.4mm Terminal Block Phoenix PT-1,5-4-3.5-H pitch 3.5mm size 14.7x7mm^2 drill 1.2mm pad 3mm Terminal Block Phoenix MKDS-3-6-5.08, 6 pins, pitch 5.08mm, size 20.3x8mm^2, drill diamater 1.3mm, pad diameter 3mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 1.5 mm² wires, reinforced insulation, conductor diameter 0.4mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST XH series connector, S13B-XASK-1N-BN (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 5 times 0.75 mm² wires, basic insulation, conductor diameter 0.48mm, outer diameter 2.7mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection, for 5 times 0.15 mm² wires, basic insulation, conductor diameter 1.4mm, outer diameter 1mm, size source Multi-Contact FLEXI-xV 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 502430-3210, 32 Pins per row (http://www.molex.com/pdm_docs/sd/431602102_sd.pdf), generated with kicad-footprint-generator JST EH series connector, B12B-J21DK-GGXR (http://www.jst-mfg.com/product/pdf/eng/eJFA-J2000.pdf), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip Type FFC/FPC, 502250-2191, 21 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ038187.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOJ, 36 Pin (https://www.onsemi.com/pub/Collateral/561AV.PDF), generated with kicad-footprint-generator ipc_noLead_generator.py DD Package; 12-Lead Plastic DFN (5mm x 4mm) (see Linear Technology 05081955_0_DHC18.pdf DHD Package; 16-Lead Plastic Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/83831/lh1533ab.pdf SSO Stretched SO SOIC Pitch 1.27 SSOP-8 2.9 x2.8mm Pitch 0.65mm HSOP 11.0x15.9mm Pitch 1.27mm SSOP, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf#page=15), generated with kicad-footprint-generator Molex LY 20 series connector, S06B-J21DK-GGXR (http://www.jst-mfg.com/product/pdf/eng/eJFA-J2000.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 64-Lead Plastic Thin Quad Flatpack (PT) - 7x7x1.0 mm Body [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 48-Lead Thin Quad Flatpack.

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