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Lead Package, 3.3x3.3x0.8mm Body, https://www.diodes.com/assets/Package-Files/PowerDI3333-8.pdf Fairchild Power33 MOSFET package, TDSON-8-1, 5.15x5.9mm (https://www.infineon.com/cms/en/product/packages/PG-TDSON/PG-TDSON-8-1/ TO-50-3 Macro T Package Style M234 Rohm HRP7 SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO263/PG-TO263-5-1/ TO-263/D2PAK/DDPAK SMD package, http://www.onsemi.com/pub/Collateral/ENA2192-D.PDF Analog Devices (Linear Tech), 133-pin BGA uModule, 15.0x15.0x4.92mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf MAPBGA 9x9x1.11 PKG, 9.0x9.0mm, 272 Ball, 17x17 Layout, 0.5mm Pitch, https://www.adestotech.com/wp-content/uploads/AT25SL321_112.pdf#page=75 WLCSP 12 1.56x1.56 https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BMM150-DS001-01.pdf WLCSP-12, 6x4 raster staggered array, 1.403x1.555mm package, pitch 0.4mm; see section 7.3 of http://www.st.com/resource/en/datasheet/stm32f042k6.pdf WLCSP-36, 6x6 raster, 2.61x2.88mm package, pitch 0.5mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f071v8.pdf WLCSP-63, 7x9 raster, 3.228x4.164mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UCBGA-49, 7x7 raster, 3.417x3.151mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l151cc.pdf WLCSP-64, 8x8 raster, 3.141x3.127mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32l152zc.pdf WLCSP-64, 8x8 raster, 3.623x3.651mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/DM00257211.pdf WLCSP-49, 7x7 raster, 3.417x3.151mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f429ng.pdf UFBGA-201, 15x15 raster, 10x10mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f051t8.pdf WLCSP-36, 6x6 raster, 2.605x2.703mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf WLCSP-81, 9x9 raster, 4.039x3.951mm package, pitch 0.4mm pad, 15x15mm, 289 Ball, 17x17 Layout, 0.5mm Pitch, DSC0010J, WSON, http://www.ti.com/lit/ds/symlink/tps61201.pdf Plastic Small Outline Narrow Body (QR)-.150" Body [QSOP] (see Microchip Packaging Specification 00000049BS.pdf TQFP, 100 Pin (JEDEC MS-013AC, https://www.analog.com/media/en/package-pcb-resources/package/233848rw_20.pdf), generated with kicad-footprint-generator Hirose DF13 through hole, DF63R-5P-3.96DSA, 5 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Straight solder pin 1 x 1 mm, 734-134 , 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST XH series connector, B9B-PH-SM4-TB (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator JST VH series connector, 53780-0570 (), generated with kicad-footprint-generator JST SUR series connector, S9B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Soldered wire connection.

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