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Interface placement f_tune = [second_col, fourth_row, 0]; pwm_cv_lvl = [second_col, third_row, 0]; fm_lvl = [h_margin+working_width/8, row_2, 0]; square_out = [third_col, fourth_row, 0]; triangle_out = [output_column, row_2, 0]; square_out = [third_col, fifth_row, 0]; square_out = [third_col, third_row, 0]; fm_lvl = [h_margin+working_width/8, row_2, 0]; cv_2b_atten = [right_col, row_2, 0]; fm_lvl = [h_margin+working_width/8, row_2, 0]; fm_lvl = [h_margin+working_width/8, row_2, 0]; square_out = [third_col, fourth_row, 0]; //Fifth row interface placement saw_out = [h_margin + working_width/4, row_1, 0]; audio_out_2 = [right_col, row_1, 0]; triangle_out = [third_col, third_row, 0]; fm_in = [first_col, first_row, 0]; sync_in = [first_col, fourth_row, 0]; pwm_cv_lvl = [width_mm - h_margin - working_width/8, row_2, 0]; fm_lvl = [second_col, second_row, 0]; //Third row interface placement square_out = [third_col, fifth_row, 0]; pwm_duty = [width_mm - h_margin - working_width/8, row_3, 0]; right_rib_x = width_mm - h_margin; working_height = height - v_margin; working_increment = (working_height-v_margin+thickness) / (9); // generally-useful spacing amount for vertical columns of stuff col_left = h_margin; col_right = width_mm - hole_dist_side, height - v_margin - title_font_size*2; working_width = width_mm - thickness; // additives - labels, etc // one more vertical to mount a circuit outside the full dev board (in some cases) Arduino + DAC https://www.youtube.com/watch?v=t3kUPjdiq0o for explainer https://drive.google.com/drive/folders/156nn9rClRLJplS4M46s56-Pibi86Z-Kp for schematics and .ino file uses an LM13700 OTA (operational transconductance amplifier) (~$1.50, uncommon, and DIP marked obsolete) and NE5532 (uncommon, 80¢ based on https://www.analog.com/media/en/technical-documentation/data-sheets/199399fc.pdf TO-92 2-pin leads in-line, narrow, oval pads, drill 0.75mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 3x-dip-switch SPST CTS_Series194-3MSTN, Piano, row spacing 7.62 mm (300 mils), Socket 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 12-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket, LongPads 48-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD 2x-dip-switch SPST KingTek_DSHP02TJ, Slide, row spacing 8.89 mm (350 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 6x-dip-switch SPST KingTek_DSHP06TJ, Slide, row spacing 25.4 mm (1000 mils), Socket 40-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 48-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/lnk520.pdf Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf 4-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils 42-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 64-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils THT DIP DIL PDIP 2.54mm 10.16mm 400mil Socket 3M 16-pin zero insertion force.

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