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Of http://www.st.com/resource/en/datasheet/DM00213872.pdf WLCSP-64, 8x8 raster, 4.539x4.911mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32l052t8.pdf WLCSP-36, 6x6 raster, 2.61x2.88mm package, pitch 0.4mm; see section 7.8 of http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, DSBGA, area grid, YBJ0008 pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306 ST WLCSP-100, off-center ball grid, ST die ID 469, 4.02x4.27mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, http://www.st.com/content/ccc/resource/technical/document/technical_note/92/30/3c/a1/4c/bb/43/6f/DM00103228.pdf/files/DM00103228.pdf/jcr:content/translations/en.DM00103228.pdf pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf UFD Package, 4-Lead Plastic Small Outline No-Lead 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Thin Shrink Small Outline (SS)-5.30 mm Body [LFCSP]; (see https://www.intersil.com/content/dam/Intersil/documents/l72_/l72.10x10c.pdf LFCSP VQ, 24 pin, exposed pad: 4.5x8.1mm, with thermal pad HTSSOP32: plastic thin shrink small outline package; 8 leads; body width 3.9 mm; lead pitch 0.65 mm (see NXP sot054_po.pdf TO-126-2, Horizontal, RM 2.54mm, IIPAK, I2PAK, see http://www.onsemi.com/pub/Collateral/EN8586-D.PDF TO-262-3 Horizontal RM 2.54mm TO-220F-3, Vertical, RM 2.54mm IIPAK I2PAK TO-262-5, Horizontal, RM 1.27mm, Multiwatt-7, staggered type-1 TO-220-7 Vertical RM 1.27mm Multiwatt-7 staggered type-2 TO-220-7 Vertical RM 5.45mm TO-3P-3, Vertical, RM 3.81mm, see https://www.onsemi.com/pub/Collateral/NJL3281D-D.PDF TO-264-5 Horizontal RM 1.7mm PentawattF- MultiwattF-5 staggered type-2 TO-220-9 Horizontal RM 2.54mm staggered type-1 TO-220F-5 Vertical RM 2.29mm IPAK TO-262-3, Horizontal, RM 5.08mm, see https://www.diodes.com/assets/Package-Files/TO126.pdf TO-126-2 Vertical RM 1.7mm staggered type-1 TO-220-15, Horizontal, RM 1.7mm, Pentawatt, Multiwatt-5, staggered type-1, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf TO-220-11 Vertical RM 5.475mm SOT-93 TO-218-3, Vertical, RM 0.97mm, Multiwatt-9, staggered type-1 TO-220F-15 Vertical RM 1.7mm PentawattF- MultiwattF-5 staggered type-1 TO-220-11, Horizontal, RM 4.58mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-2 Horizontal RM 1.27mm Multiwatt-7 staggered type-1 TO-220F-9, Vertical, RM 5.45mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-3 Vertical RM 10.9mm TO-247-2, Vertical, RM 2.54mm, see https://www.diodes.com/assets/Package-Files/TO126.pdf TO-126-3 Horizontal RM 2.286mm SIPAK, Vertical, RM 2.54mm, staggered type-2 TO-220F-7, Vertical, RM 2.54mm, staggered type-1 TO-220F-4, Vertical, RM 1.7mm, staggered type-2, see http://www.st.com/resource/en/datasheet/l298.pdf TO-220-15 Vertical RM 2.54mm staggered type-2 TO-220-15, Vertical, RM 1.7mm, staggered type-1, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf TO-220-11 Vertical RM 1.27mm staggered type-2 TO-220-9, Horizontal, RM 5.45mm, see https://www.fairchildsemi.com/package-drawings/TO/TO264A03.pdf TO-264-3 Horizontal RM 1.7mm MultiwattF-11 staggered type-1 TO-220-4 Horizontal RM 10.9mm TO-247-3, Horizontal, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 5.08mm 2.54 4-lead dip package for Everlight ITR8307 with PCB locator, 11 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0834-6-81&productname=DF12E(3.0)-50DP-0.5V(81)&series=DF12&documenttype=2DDrawing⟨=en&documentid=0000992393), generated with kicad-footprint-generator Hirose DF11 through hole, DF11-14DP-2DSA, 7 Pins (https://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=826576&DocType=Customer+Drawing&DocLang=English), generated with kicad-footprint-generator Soldered wire connection, for 3 times 0.75 mm² wires, reinforced insulation, conductor diameter 1.4mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py UQFN, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/atmel-8235-8-bit-avr-microcontroller-attiny20_datasheet.pdf#page=212), generated with kicad-footprint-generator ipc_noLead_generator.py VQFN, 28 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-9505-AT42-QTouch-BSW-AT42QT1060_Datasheet.pdf#page=28), generated with kicad-footprint-generator Molex.

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