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4.4 mm; Exposed Pad Variation BB; (see Linear Technology DFN_6_05-08-1703.pdf 6-Lead Plastic Small Outline (SS)-5.30 mm Body [SOIC] (https://docs.broadcom.com/docs/AV02-0169EN SOIC 1.27 SSO, 7 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip THT 1x31 1.27mm single row style2 pin1 right Through hole socket strip THT 2x24 1.27mm double row surface-mounted straight pin header, 2x10, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole vertical IDC header THT 2x15 2.00mm double row surface-mounted straight socket strip, 1x20, 2.54mm pitch, single row Through hole socket strip THT 2x03 2.54mm double row Through hole angled pin header, see http://www.formfactors.org/developer%5Cspecs%5Crev1_2_public.pdf pin header THT 2x11 2.54mm double row Through hole straight pin header, 2x13, 2.54mm pitch, 8.51mm socket length, double rows Through hole pin header THT 1x15 2.54mm single row male, vertical entry Harwin.

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