Labels Milestones
BackJunior, 7x7mm, 113 ball 12x12 grid, NSMD pad definition Appendix A BGA 400 0.8 CLG400 CL400 Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=273, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=284, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=84, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Through hole socket strip THT 2x08 1.00mm double row Through hole pin header THT 2x37 2.54mm double row Through hole angled pin header, 1x02, 1.27mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole pin header THT 1x24 1.27mm single row (from Kicad 4.0.7), script generated Through hole straight socket strip, 1x23, 2.54mm pitch, double rows Through hole pin header SMD 2x28 1.00mm double row Through hole pin header THT 1x10 2.54mm single row style2 pin1 right Through hole straight socket strip, 2x16, 1.00mm pitch, single row Through hole angled pin header.
New Pull Request