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BackPins package 1x0.8mm pitch 0.35mm SOT-1123 small outline package; 24 leads; body width 16.90 mm Power-Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), LongPads 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 6-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 40-pin zero insertion force socket, through-hole, row spacing 15.24 mm (600 mils), Socket 12-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 6-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 24-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 5x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), LongPads 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils.
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