Labels Milestones
Back0.4mm http://www.ti.com/lit/ds/symlink/txb0108.pdf USON-20 2x4mm Pitch 0.4mm 8-Lead Plastic Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of TO-92), also known as TO-226, wide, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf.