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1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=265, NSMD pad definition Appendix A BGA 484 1 FB484 FBG484 FBV484 Artix-7, Kintex-7 and Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=77, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, area grid, YZT, 1.86x1.36mm, 12 Ball, 4x3 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A BGA 196 0.5 CPGA196 Artix-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole angled pin header SMD 1x03 1.00mm single row Through hole pin header THT 2x19 2.54mm double row Through hole vertical IDC box header THT 1x22 2.00mm single row style1 pin1 left Surface mounted socket strip SMD 2x37 1.27mm double row Through hole angled socket strip, 1x11, 2.00mm pitch, 6.35mm socket length, single row Through hole socket strip SMD 2x20 1.27mm double row Through hole straight socket strip, 1x07, 2.00mm pitch, double rows Through hole IDC header, 2x32, 1.27mm pitch, single row Through hole straight socket strip, 2x15, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf SMD vertical IDC box header, 2x13, 2.54mm pitch, single row style1 pin1 left Surface mounted pin header SMD 2x38 1.27mm double row surface-mounted straight socket strip, 2x29, 2.00mm pitch, single row (from Kicad 4.0.7), script generated Surface mounted pin header THT 1x08 1.00mm single row style1 pin1 left Surface mounted socket strip SMD 2x06 2.00mm double row Through hole IDC header, 2x30, 2.54mm.

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