Labels Milestones
Back1.27mm, Multiwatt-7, staggered type-2 TO-220F-7, Vertical, RM 1.7mm, staggered type-2, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf TO-220-11 Vertical RM 5.45mm TO-264-5, Horizontal, RM 2.54mm, staggered type-2 TO-220F-9, Vertical, RM 5.45mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-2 Horizontal RM 10.9mm TO-247-3, Horizontal, RM 2.54mm, staggered type-1 TO-220-5, Vertical, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 2.54mm 10.16mm 400mil 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), https://toshiba.semicon-storage.com/info/docget.jsp?did=1421&prodName=TLP3021(S Toshiba 11-7A9 package, like 6-lead dip package for diode bridges, row spacing 7.62 mm (300 mils DIL DIP PDIP 2.54mm 25.4mm 1000mil Socket 3M 14-pin zero insertion force socket, through-hole, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 24-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 6.7x21.88mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 8x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), LongPads 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 22.86mm 900mil Socket 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of 8-Lead Plastic DFN (4mm x 3mm) (see Linear Technology 05081707_A_DHD16.pdf DH Package; 16-Lead Plastic Small Outline.
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