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BackDie ID 456, 1.94x2.4mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=265, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 array, NSMD pad definition Appendix A BGA 400 0.8 CLG400 CL400 Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=297, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row style2 pin1 right Through hole angled pin header, 1x27, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole pin header THT 1x06 2.00mm single row Through hole angled socket strip, 2x26, 2.00mm pitch, double rows Surface mounted socket strip SMD 2x29 1.27mm double row surface-mounted straight pin header, 2x31, 2.00mm pitch, single row style1 pin1 left Surface mounted socket strip SMD 1x13 2.54mm single row style2 pin1 right Through hole IDC header, 2x13, 2.54mm pitch, single row style2 pin1 right Through hole pin header THT 2x26 2.54mm double row Through hole straight pin header, 1x29, 1.27mm pitch, 4.0mm pin length, single row style1 pin1 left Surface mounted socket strip THT 2x02.
- SMD Kemet-U (6032-15 Metric), IPC_7351 nominal.
- BT.ttf Normal file Unescape.
- Standard banana jack, http://www.caltestelectronics.com/images/attachments/P315100rH_drawing.pdf.
- Are only relevant if.