Labels Milestones
Back8-Pin ePad 3mm x 3mm MLF - 3x3x0.85 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf eSOP-12B SMT Flat Package with Heatsink Tab, https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 18-pin zero insertion force socket, through-hole, row spacing 10.16 mm (400 mils 14-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils SMD DIP Switch SPST Piano 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET S1 MOSFET Infineon DirectFET ME MOSFET Infineon DirectFET S3C MOSFET Infineon DirectFET SC MOSFET Infineon DirectFET MP MOSFET Infineon DirectFET MA MOSFET Infineon DirectFET SH MOSFET Infineon DirectFET M4 MOSFET Infineon DirectFET LA MOSFET Infineon DirectFET M4 MOSFET Infineon DirectFET M2 MOSFET Infineon DirectFET MP MOSFET Infineon DirectFET S3C MOSFET Infineon DirectFET MP MOSFET Infineon DirectFET MD MOSFET Infineon DirectFET MC MOSFET Infineon DirectFET MU MOSFET Infineon DirectFET MA MOSFET Infineon DirectFET MP MOSFET Infineon DirectFET SJ MOSFET Infineon DirectFET MX MOSFET Infineon DirectFET LA MOSFET Infineon DirectFET ST MOSFET Infineon DirectFET S1 MOSFET Infineon DirectFET ST MOSFET Infineon DirectFET SJ MOSFET Infineon PLCC, 20 pins, dual row (http://ww1.microchip.com/downloads/en/DeviceDoc/64L_VQFN_7x7_Dual_Row_%5BSVB%5D_C04-21420a.pdf 40-Lead (32-Lead Populated) Plastic Quad Flat, No Lead Package - 3x3 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf DFN, 6 Pin (https://www.silabs.com/documents/public/data-sheets/si512-13.pdf), generated with kicad-footprint-generator Molex PicoBlade.
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