Labels Milestones
BackFill applied everywhere there isn't a trace already - use spokes where ground planes connect to holes - these gaps reduce heat conduction during soldering - ground planes are copper fill applied everywhere there isn't a trace on one side when convenient. You can use one on both sides, or do partial planes where convenient. Hardware/PCB/precadsr/potsetc.kicad_sch Normal file View File From 744b72ef7e0d94fccfae99ec3cb3514981ac4616 Mon.
- -7.22332 -1.01854 7.61242 facet normal.
- -0.000349206 0.993298 facet normal 0.0458387 0.92006 0.389086.
- - the current 12-position.