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Pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header THT 1x23 2.54mm single row (from Kicad 4.0.7), script generated Through hole straight socket strip, 1x29, 1.00mm pitch, double rows Through hole straight pin header, 2x02, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip SMD 2x03 2.00mm double row Through hole angled pin header, 1x16, 2.00mm pitch, single row Through hole angled socket strip SMD 1x16 2.00mm single row style1 pin1 left Surface mounted socket strip SMD 2x14 2.54mm double row surface-mounted straight socket strip, 1x30, 2.54mm pitch, single row (from Kicad 4.0.7), script generated Surface mounted pin header THT 2x15 2.54mm double row surface-mounted straight socket strip, 2x27, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header THT 1x19 5.08mm single row Through.

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