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0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf ST WLCSP-115, ST die ID 483, 3.73x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf ST WLCSP-115, ST die ID 483, 3.73x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD.

100644 Hardware/PCB/precadsr/ao_tht.pretty/C_Rect_L7.2mm_W2.5mm_P5.00mm_FKS2_FKP2_MKS2_MKP2.kicad_mod delete mode 100644 Hardware/PCB/precadsr_Gerbers/precadsr-F_Mask.gbr create.
5.9343 5.50622 19.9509 vertex -2.91914.
Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/64L_VQFN_8x8_with%206_5x6_5%20EP_JXX_C04-0437A.pdf), generated with.
MC_1,5/7-GF-3.5; number of pins: 10.

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