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Pitch, https://www.st.com/resource/en/datasheet/stm32g431c6.pdf ST WLCSP-49, ST die ID 483, 3.73x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, http://www.latticesemi.com/view_document?document_id=213 WLCSP-16 2.225x2.17mm, 2.17x2.225mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, https://ww1.microchip.com/downloads/en/DeviceDoc/16B_WLCSP_CS_C04-06036c.pdf WLCSP-20, 4x5 raster, 1.934x2.434mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UCBGA-81.

Thickness-1; STLs, 10hp version.
9.28685 3.54602 facet normal 0.300158 0.365745 0.880985 vertex.
0.572633 0.808202 facet normal 9.957868e-01.
121.92 119.38 "Notes": "Layer B.Cu" "Notes.
Normal -7.808479e-001 -4.933095e-003 6.247017e-001 vertex 4.116141e+000 1.627492e+000 2.488700e+001.

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