Labels Milestones
BackVSON, 3x3mm Body, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf BGA 12 0.5 R-XBGA-N12 Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=93, NSMD pad definition Appendix A Artix-7 BGA, 22x22 grid, 23x23mm.
- C3 and C4 could.
- Pitch=30mm, , length*diameter=25*10mm^2, Electrolytic Capacitor, http://cdn-reichelt.de/documents/datenblatt/B300/TANTAL-TB-Serie%23.pdf CP.
- Terminal, single row, 01x03 D 2x5 pin shrouded.
- Itrip=16.5A, http://www.bourns.com/docs/product-datasheets/mfrht.pdf PTC Resettable Fuse, Ihold.