Labels Milestones
Back"Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" "Name": "Bottom Silk Screen" "Name": "Top Solder Mask" "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" "Name": "Bottom Solder Paste" "Name": "Bottom Solder Mask" "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" "Name": "Bottom Silk Screen" "Name": "Top Solder Paste" "Name": "Bottom Silk Screen" Hardware/Panel/precadsr-panel/precadsr-panel-cache.lib Normal file Unescape Synth Mages Power Word Stun.kicad_pcb 23480 lines general (thickness 1.6) paper "A4") updates to rev 2.
- BGA (based on standard DIP-4), row spacing 22.86.
- ============================================================= SW_DIP_x05 SW 0 40 Y N 1 F.
- (https://cdn.microsemi.com/documents/1bf6886f-5919-4508-a50b-b1dbf3fdf0f4/download/#page=98), generated with kicad-footprint-generator.