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Pad (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF WDFN, 12 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/6957fb.pdf#page=36), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP8: plastic thin shrink small outline package; 48 leads; body width 4.4 mm (http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG SSOP20: plastic shrink small outline package; 24 leads; body width 16.90 mm Power-Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD 3x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils 48-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils 16-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD 3x-dip-switch SPST Copal_CVS-03xB, Slide, row spacing 7.62 mm (300 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x27.58mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 4x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 2x-dip-switch SPST , Slide, row spacing 10.16 mm (400 mils), LongPads 32-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 48-lead though-hole mounted high-volatge DIP package (based on http://www.latticesemi.com/view_document?document_id=213 BGA 0.8mm 9mm 121 BGA-132 11x17 12x18mm 1.0pitch Altera BGA-144 M144 MBGA Altera BGA-153 M153 MBGA Altera UBGA U324 BGA-324 BGA-624, 25x25 grid, 21x21mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f103ze.pdf WLCSP-64, 8x8 raster, 4.466x4.395mm package, pitch 0.4mm; see section 6.8 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf TFBGA-100, 10x10, 9x9mm package, pitch 0.4mm; see section 10.3 of https://www.parallax.com/sites/default/files/downloads/P8X32A-Propeller-Datasheet-v1.4.0_0.pdf 44-Lead Plastic Thin Quad Flatpack (PT) - 7x7x1.0 mm Body, 2.00 mm Footprint [TQFP] (see Microchip Packaging Specification 00000049BS.pdf QFN Microchip 8E 16 QFN, 44 Pin, dual row male, vertical entry, strain relief clip Harwin LTek Connector, 17 pins, single row Through hole angled socket strip SMD 2x02 2.54mm double row SMD IDC box header THT 2x25 1.00mm double row surface-mounted straight pin header, 2x08, 2.00mm pitch, 4.2mm pin length, single row Through hole angled pin header SMD 1x24 1.27mm single row (from Kicad 4.0.7), script generated Through hole angled pin header SMD 1x35 1.00mm single row Through hole straight pin header, 2x38, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Surface mounted pin header SMD 2x39 2.00mm double row Through hole angled pin header THT 2x13 2.54mm double row surface-mounted straight pin header, 1x14, 2.00mm pitch, 4.2mm pin length, single row.

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