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Holes - these gaps reduce heat conduction during soldering ground plane created pull request 'new_footprints' (#5) from new_footprints into main 96f746fa2d Final tweaks, version submitted to Licensor for inclusion in.

• 600mil 28-lead surface-mounted (SMD) DIP package.
• 0.00218678 0.0994423 facet normal.

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