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Plastic SO, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf DFN package size 32.2x9.1x15mm^3, https://www.recom-power.com/pdf/Innoline/R-5xxxPA_DA.pdf.

• Normal 0.137352 -0.452792 0.880973 vertex.
• Block, 1732412 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1732412), generated with kicad-footprint-generator Molex Mini-Universal.
• 3.34544 12.85 vertex -1 7.29533 6.97071.

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