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Https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (area) array, NSMD pad definition Appendix A BGA 1924 1 FF1926 FFG1926 FF1927 FFG1927 FFV1927 FF1928 FFG1928 FF1930 FFG1930 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, NSMD pad definition Appendix A BGA 900 1 FF900 FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole IDC box header, 2x03, 2.00mm pitch, double rows Through hole angled socket strip SMD 1x19 2.54mm single row style1 pin1 left Surface mounted pin header THT 2x21 1.27mm double row Through hole straight Samtec HPM power header series 11.94mm post length, 1x16, 5.08mm pitch, single row style1 pin1 left Surface mounted socket strip SMD Solder 3-pad Jumper, 1x1.5mm Pads, 0.3mm gap, pads 1-2 bridged with 1 copper strip, labeled with numbers SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, pads 1-2 bridged with 2 copper strips net tie solder jumper bridged SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, pads 1-2 Bridged2Bar with 2 copper strip SMD 2x05 2.00mm double row Through hole angled socket strip, 2x05, 1.27mm pitch, 4.4mm socket length, double rows Through hole straight socket strip, 2x21, 1.27mm.

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