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502382-1170 (http://www.molex.com/pdm_docs/sd/5023820270_sd.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: A-41792-0010 example for new mpn: 39-30-0180, 9 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py WDFN, 6 pin, https://www.winsen-sensor.com/d/files/semiconductor/mq-6.pdf Sensair S8 Series CO2 sensor, 1kHz PWM output, Modbus, THT co2 gas sensor pwm modbus Sensirion SCD4x QFN, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/doc2535.pdf#page=164), generated with kicad-footprint-generator Mounting Hardware, inside through hole 4.5mm, height 5, Wuerth electronics 97730356330 (https://katalog.we-online.com/em/datasheet/97730356330.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 20-Lead Plastic Thin Shrink Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads THT DIP DIL ZIF 15.24mm 600mil LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 16-lead.

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