Labels Milestones
BackWLCSP-90, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.55mm Pitch, https://www.dialog-semiconductor.com/sites/default/files/da1469x_datasheet_3v1.pdf#page=740 VFBGA-100, 10x10, 7x7mm package, pitch 0.5mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32l476me.pdf WLCSP-81, 9x9 raster, 4.4084x3.7594mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l151cc.pdf WLCSP-64, 8x8 raster, 3.141x3.127mm package, pitch 0.5mm; see section 7.1 of http://www.st.com/resource/en/datasheet/DM00282249.pdf WLCSP-90, 10x9 raster, 4.223x3.969mm package, pitch 0.35mm; https://datasheets.maximintegrated.com/en/ds/MAX40200.pdf WLP-9, 1.448x1.468mm, 9 Ball, 3x3 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100489.PDF WLCSP-25, 5x5 raster, 2.133x2.070mm package, pitch 0.8mm; http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495 TFBGA-216, 15x15 raster, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition Appendix A BGA 1760 1 FH1761 FHG1761 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=304, NSMD pad definition Appendix A BGA 324 0.8 GateMate FPGA Maxim WLP-12, W121H2+1, 2.008x1.608mm, 12 Ball, 4x3 Layout, 0.4mm Pitch, http://www.st.com/content/ccc/resource/technical/document/technical_note/92/30/3c/a1/4c/bb/43/6f/DM00103228.pdf/files/DM00103228.pdf/jcr:content/translations/en.DM00103228.pdf pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf UFD Package, 4-Lead Plastic Small Outline (SO) - Wide, 7.50 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf DFN package size 32.2x9.1x15mm^3, https://www.recom-power.com/pdf/Innoline/R-5xxxPA_DA.pdf dc-dc recom buck sip-3 pitch 2.54mm size 20.8x6.2mm^2 drill 1.1mm pad 2.1mm Terminal Block WAGO 236-624, 45Degree (cable under 45degree), 2 pins, pitch 5mm, size 15x10.5mm^2, drill diamater 1.2mm, pad diameter 2mm, outer diameter 1.7mm, size source Multi-Contact FLEXI-E 0.15 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.127 mm² wire, basic insulation, conductor diameter 0.65mm, outer diameter 2.3mm, see http://www.metz-connect.com/de/system/files/productfiles/Datenblatt_310591_RT063xxHBWC_OFF-022684T.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block Metz Connect Type101_RT01606HBWC pitch 5.08mm size 20.3x8.45mm^2 drill 1.1mm pad 2.1mm terminal block connector http://www.phoenixcontact.com/us/products/1814731/pdf PhoenixContact PTSM0.5 5 2.5mm vertical SMD spring clamp terminal block RND 205-00073 pitch 7.5mm Varistor, diameter 9mm, width 5.5mm, pitch 5mm Varistor, diameter 12mm, width 4.2mm, pitch 5mm Varistor, diameter 9mm, width 4mm, pitch 7.5mm length 5.1mm diameter 3.1mm C, Axial series, Axial, Horizontal, pin pitch=15mm, , length*diameter=3.8*2.6mm^2, http://www.vishay.com/docs/45231/arseries.pdf C Axial series Axial Horizontal pin pitch 23.90mm diameter 24.4mm muRATA 1400series Inductor, Radial series, Radial, pin pitch=5.00mm, , diameter=4.5mm, Tantal Electrolytic Capacitor, , http://www.vishay.com/docs/28325/021asm.pdf CP Axial series Axial Horizontal pin pitch 12.7mm length 8.9mm diameter 3.7mm Diode, 5W series, Axial, Horizontal, pin pitch=30mm, , length*diameter=25*10mm^2, Electrolytic Capacitor, , http://www.vishay.com/docs/42037/53d.pdf.