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TO-247-3, Vertical, RM 5.45mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-2 Vertical RM 2.54mm IIPAK I2PAK TO-262-5, Horizontal, RM 5.45mm, see https://www.fairchildsemi.com/package-drawings/TO/TO264A03.pdf TO-264-2 Horizontal RM 5.08mm TO-220F-3, Horizontal, RM 1.7mm, staggered type-1, see http://www.st.com/resource/en/datasheet/l298.pdf TO-220-15 Vertical RM 10.9mm TO-247-3, Horizontal, RM 4.58mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-3 Horizontal RM 1.7mm staggered type-2 TO-220F-4, Vertical, RM 2.29mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-3 Horizontal RM 0.97mm Multiwatt-9 staggered type-1 TO-247-2, Horizontal, RM 1.7mm, PentawattF-, MultiwattF-5 TO-220F-5 Vertical RM 1.7mm MultiwattF-11 staggered type-2 TO-220-4 Vertical RM 2.54mm TO-220F-4, Vertical, RM 5.08mm, see http://www.vishay.com/docs/88769/woo5g.pdf diode bridge Low Profile 8x8mm PQFN, Dual Cool 88, https://www.onsemi.com/pub/Collateral/FDMT80080DC-D.pdf TO-50-4 Power Macro Package Style M236 TO-50-4 Macro X Package Style M234 Rohm HRP7 SMD package, http://www.ti.com/lit/ds/symlink/lm4755.pdf D2PAK DDPAK TO-263 D2PAK-7 TO-263-7 SOT-427 TO-263 / D2PAK / DDPAK SMD package, http://www.onsemi.com/pub/Collateral/ENA2192-D.PDF Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf LFCSP 8pin thermal pad HTSSOP32: plastic thin shrink small outline package; 44 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot266-1_po.pdf SSOP, 20 Pin (http://www.ti.com/lit/ds/symlink/opa569.pdf, http://www.ti.com/lit/an/slma004b/slma004b.pdf), generated with kicad-footprint-generator Connector Phoenix Contact connector footprint for: MC_1,5/11-GF-3.5; number of pins: 11; pin pitch: 7.50mm; Angled || order number: 1776922 12A || order number: 1847628 8A 320V Generic Phoenix Contact connector footprint for: MCV_1,5/3-GF-3.5; number of pins: 12; pin pitch: 5.08mm; Vertical || order number: 1843839 8A 160V Generic Phoenix Contact connector footprint.

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