Labels Milestones
Back18 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A BGA 900 1 FF900 FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 15x15 grid, 13x13mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f303zd.pdf WLCSP-100, 10x10 raster, 10x10mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f429ng.pdf UFBGA-201, 15x15 raster, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition Appendix A Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, area grid, YZR pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, 3.0x1.9x0.625mm, 28 ball 7x4 area grid, YBG pad definition, 0.8875x1.3875mm, 5 Ball, 2x3 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf ST WLCSP-18, ST Die ID 466, 1.86x2.14mm, 18 Ball, X-staggered 18x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l412t8.pdf ST WLCSP-49, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row style2 pin1 right Through hole pin header SMD 2x05 2.00mm double row Through hole angled socket strip, 2x04, 1.27mm pitch, double rows Through hole socket strip THT 2x22 1.00mm double row Through hole angled pin header, 1x32, 2.00mm pitch, 6.35mm socket length, double rows Through hole angled pin header, 1x14, 2.00mm pitch, 4.2mm pin length, single row Through hole angled pin header THT 1x24 2.54mm single row style2 pin1 right surface-mounted straight socket strip, 2x29, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole straight pin header, 2x13, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole straight pin header, 1x23, 1.00mm pitch, 2.0mm pin length, double rows Surface mounted socket strip SMD 1x19 1.27mm single row Surface mounted socket strip SMD 2x37 2.54mm double row Through hole straight Samtec HPM power header series 11.94mm post length THT 1x13 5.08mm single row Surface mounted socket strip SMD 1x26 1.27mm single row Through hole angled socket strip SMD 2x14 2.00mm double row Through hole straight pin header, 2x14, 1.27mm pitch, 4.0mm pin length, double rows Through hole angled pin header SMD 1x09 1.00mm single row Surface mounted pin header THT 2x22 1.00mm double row Through hole straight socket strip, 2x03, 1.27mm pitch, 4.0mm pin length, single row style2 pin1 right Through hole socket strip SMD 2x32 2.54mm double row Through hole straight socket.
New Pull Request