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0.8mm Altera BGA-68 M68 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 22.86 mm (900 mils), SMDSocket, LongPads 5-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 20-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 8x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), LongPads 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 1x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), LongPads, see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL ZIF 7.62mm 300mil 3-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils THT DIP DIL PDIP 2.54mm 10.16mm 400mil Socket LongPads 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 64-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/lnk520.pdf Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 5x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 11x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 10-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads.

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