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73 Ball, 9x9 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100, off-center ball grid, ST die ID 467, 3.09x3.15mm, 52 Ball, X-staggered 21x11 Layout, 0.4mm Pitch.

• FFC/FPC Connector, For LVDS, 2.33mm Height, Right Angle.
• -5.44339 19.9417 facet normal -0.268375 -0.884724 0.381101 vertex.
• -9.041368e+01 1.006749e+02 1.197185e+01 facet normal 0.956943 0.290276.
• 0.279012 0.0846382 0.95655 vertex -8.07502 0 5.88782.

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