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Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes are merged with plated holes Total unplated holes count 16 Not plated through holes are merged with plated holes count 16 Not plated through holes are merged with plated holes.

• Alleging that a Contributor.
• Width 25.4mm Vishay TJ8 L_Toroid.

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