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FGG676 Spartan-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 array, NSMD pad definition Appendix A Spartan-7 BGA, 14x14 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition Appendix A BGA 676 1 RF676 RFG676 Artix-7 BGA, 18x18 grid, 15x15mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=299, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole angled socket strip, 1x25, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole IDC header, 2x12, 2.54mm pitch, 6mm pin length, single row Surface mounted pin header THT 2x31 2.00mm double row surface-mounted straight pin header, 1x05, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight Samtec HPM power header series 3.81mm post length THT 1x18 2.54mm single row Through hole straight socket strip, 2x07, 1.27mm pitch, single row Surface mounted pin header SMD 1x16 2.54mm single row Through hole pin header SMD 1x32 1.27mm single row Through hole angled socket strip, 2x32, 1.27mm pitch, 4.4mm socket length, double rows Through hole socket strip THT 1x10 1.27mm single row Through hole straight socket strip.

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